High Density Interconnect (HDI) Printed Circuit Boards
High density interconnect (HDI) printed circuit board utilizes the latest technology to increase the use of printed circuit board under the same or smaller area. This has driven major advances in mobile phones and computer products, resulting in revolutionary new products, which includes touch-screen computers and 4G communications and military applications, such as avionics and smart military equipment.
High density interconnect (HDI) printed circuit board is characterized by high density properties, including laser microholes, fine lines, and high performance thin materials. This increased density can support more functions per unit area. High density interconnect (HDI) printed circuit board with high technology contains multilayer stacked copper microholes (high level HDI printed circuit boards) that can be used to create more complex interconnections. These very complex structures provide the necessary wiring solutions for large lead count chips used in today's mobile devices and other high-tech products.
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